The properties of epoxy–imide resin cured by cyclic phosphine oxide diacid
✍ Scribed by Wen-Hsiang Hsu; Min-Da Shau
- Publisher
- John Wiley and Sons
- Year
- 1996
- Tongue
- English
- Weight
- 440 KB
- Volume
- 62
- Category
- Article
- ISSN
- 0021-8995
No coin nor oath required. For personal study only.
✦ Synopsis
A new phosphorylated epoxy-imide polymer synthesized was obtained using diimidediepoxide (DIDE) resin cured with the new curing agent, 10-phenylphenoxa-phosphine- 3&dicarboxylic acid-10-oxide (PCAO). In addition, compositions of the synthesized diimidediepoxide (DIDE), Epon 828, with common curing agents, e.g., 4,4'-diaminodiphenylether (DDE) and 4,4'-diaminodiphenylsulfone (DDS), were used for making a comparison of its curing reactivity a n d heat, and flame retardation with t h a t of (PCAO). T h e reactivities of those curing agents toward the two kinds of epoxy resins, as measured by differential scanning calorimetry (DSC), were in the following order: DDE > PCAO > DDS. Through evaluation of thermal gravimetric analysis (TGA), the thermal and flame resistances of epoxy polymers were confirmed in this study as capable of being significantly improved through introduction of imide and cyclic phosphine oxide group into the epoxide and curing agent structures.
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A new phosphorylated epoxy polymer was obtained using Epon 828 resin cured with a phosphorus-containing curing agent, 10-phenylphenoxaphosphine-2,3,7,8tetracarboxylic acid-10-oxide (PDAC). In addition, compositions of Epon 828 with common curing agents, for example, 4,4Ј-diaminodiphenylmethane (DDM)
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