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Curing behavior and thermal properties of trifunctional epoxy resin cured by 4,4′-diaminodiphenylmethane

✍ Scribed by Cheng Jue; Li Juan; Yang Wantai

Publisher
John Wiley and Sons
Year
2009
Tongue
English
Weight
381 KB
Volume
114
Category
Article
ISSN
0021-8995

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