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Crystallization-induced stress in tungsten nitride thin films

✍ Scribed by Y. G. Shen; Y. W. Mai


Book ID
110241039
Publisher
Springer
Year
2000
Tongue
English
Weight
79 KB
Volume
19
Category
Article
ISSN
0261-8028

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Titanium nitride films, as used for hard coatings, were deposited on silicon wafers by reactive unbalanced magnetron sputtering. For thinner films we find a higher compressive average residual stress than for thicker films. In the paper it is shown that this reduction in average stress is not due to