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Critical cutting thickness in ultra-precision machining of single crystal silicon

✍ Scribed by Minghai Wang, Wei Wang, ZeSheng Lu

Book ID
120742278
Publisher
Springer
Year
2012
Tongue
English
Weight
976 KB
Volume
65
Category
Article
ISSN
0268-3768

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✍ Hideo Takino; Toshimitsu Ichinohe; Katsunori Tanimoto; Syuichi Yamaguchi; Kazush πŸ“‚ Article πŸ“… 2004 πŸ› Elsevier Science 🌐 English βš– 302 KB

Smoothly polished single-crystal silicon plates were cut by wire electrical discharge machining (WEDM) in water and in oil in order to investigate the effect of WEDM on the polished surfaces. For cutting in water, polished surfaces near cut sections have chips and cracks, and are extremely rough; th