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Creep properties of Sn–Sb based lead-free solder alloys

✍ Scribed by A.A. El-Daly; Y. Swilem; A.E. Hammad


Book ID
116603586
Publisher
Elsevier Science
Year
2009
Tongue
English
Weight
710 KB
Volume
471
Category
Article
ISSN
0925-8388

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