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Crack propagation and fracture in silicon wafers under thermal stress

โœ Scribed by Danilewsky, Andreas; Wittge, Jochen; Kiefl, Konstantin; Allen, David; McNally, Patrick; Garagorri, Jorge; Elizalde, M. Reyes; Baumbach, Tilo; Tanner, Brian K.

Book ID
120449794
Publisher
International Union of Crystallography
Year
2013
Tongue
English
Weight
502 KB
Volume
46
Category
Article
ISSN
0021-8898

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๐Ÿ“œ SIMILAR VOLUMES

Crack propagation under constant deforma
Crack propagation under constant deformation and thermal stress fracture
โœ D. P. H. Hasselman ๐Ÿ“‚ Article ๐Ÿ“… 1971 ๐Ÿ› Springer Netherlands ๐ŸŒ English โš– 291 KB

An analogy is drawn for crack propagation m brittle solids under constant deformation (strata) and under thermal shock. Following the original approach by Berry it is shown theoretically that under constant deformation an initially short crack, unstable at a critical strain, propagates to a new leng