Crack propagation under constant deformation and thermal stress fracture
โ Scribed by D. P. H. Hasselman
- Publisher
- Springer Netherlands
- Year
- 1971
- Tongue
- English
- Weight
- 291 KB
- Volume
- 7
- Category
- Article
- ISSN
- 1573-2673
No coin nor oath required. For personal study only.
โฆ Synopsis
An analogy is drawn for crack propagation m brittle solids under constant deformation (strata) and under thermal shock. Following the original approach by Berry it is shown theoretically that under constant deformation an initially short crack, unstable at a critical strain, propagates to a new length which requires a finite increase m strain before it will become unstable agaln~ Similar behavior is expected under conditions of thermal shock where an initially short crack unstable at a critical temperature difference, propagates to a new length such that a finite increase in temperature difference is required before the crack will again continue to propagate. Relative changes in strength as a result of this type of crack behavior are predicted and verified by experimental results for two industrial polycrystalline aluminum oxides subjected to thermal shock by means of a water quench. * Coeffioent of variation. ** Number of specimens.
๐ SIMILAR VOLUMES
Tensile stress relaxation and stable crack growth under fixed tensile deformation over an extended range of crack speeds were measured on a flexible thermosetting epoxy resin. The experimental results are analysed and compared with the predictions of two theoretical models of fiacture kinetics in vi