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Constitutive relations on creep for SnAgCuRE lead-free solder joints

✍ Scribed by Zhigang Chen; Yaowu Shi; Zhidong Xia

Publisher: Springer US
Year: 2004
Tongue: English
Weight: 252 KB
Volume: 33
Category: Article
ISSN: 0361-5235
DOI: 10.1007/s11664-004-0023-z

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