𝔖 Bobbio Scriptorium
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Conductive polymers for microelectronic packaging: chip bonding to polymer films

✍ Scribed by Frank Küchenmeister; Matthias Böttcher; Ekkehard Meusel; Dieter Meier

Book ID
102660105
Publisher
John Wiley and Sons
Year
1998
Tongue
English
Weight
887 KB
Volume
9
Category
Article
ISSN
1042-7147

No coin nor oath required. For personal study only.

✦ Synopsis

Conductive Polymers for Microelectronic Packaging / 807 FIGURE 7. Copper electroplated onto polypyrrole prior deposited on polyimide foil, adhesive and aluminum bond pad: left, top view (SEM); right, cross section (micrograph).

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