4933042 Method for packaging integrated circuit chips employing a polymer film overlay layer

✍ Scribed by CharlesW Eichelberger; Robert Wojnarowski; Kenneth Wells

• Book ID: 103282411
• Publisher: Elsevier Science
• Year: 1991
• Tongue: English
• Weight: 86 KB
• Volume: 31
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(91)90268-c