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Comparisons of conventional, 3-D, optical, and RF interconnects for on-chip clock distribution

✍ Scribed by Kuan-Neng Chen; Kobrinsky, M.J.; Barnett, B.C.; Reif, R.

Book ID: 114617308
Publisher: IEEE
Year: 2004
Tongue: English
Weight: 373 KB
Volume: 51
Category: Article
ISSN: 0018-9383
DOI: 10.1109/ted.2003.821567

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