[IEEE 2011 Materials for Advanced Metallization (MAM) - Dresden, Germany (2011.05.8-2011.05.12)] 2011 IEEE International Interconnect Technology Conference - Impact of through-silicon-via scaling on the wirelength distribution of current and future 3D ICs

✍ Scribed by Kim, Dae Hyun; Lim, Sung Kyu

• Book ID: 115488548
• Publisher: IEEE
• Year: 2011
• Weight: 156 KB
• Volume: 0
• Category: Article
• ISBN: 1457705036
• DOI: 10.1109/iitc.2011.5940324