Combined low-frequency noise and resistance measurements for void extraction in deep-submicrometer interconnects

✍ Scribed by L. W. Chu; W. K. Chim; K. L. Pey; J. Y. K. Yeo; L. Chan

• Book ID: 107452680
• Publisher: Springer US
• Year: 2001
• Tongue: English
• Weight: 304 KB
• Volume: 30
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-001-0167-z