๐”– Bobbio Scriptorium
โœฆ   LIBER   โœฆ

SPIE Proceedings [SPIE International Symposium on Microelectronics and Assembly - Singapore, Singapore (Monday 27 November 2000)] Microelectronic Yield, Reliability, and Advanced Packaging - Estimation of the area of voids in deep-submicron aluminium interconnects using resistance-noise measurements

โœ Scribed by Chu, Lip W.; Pey, Kin L.; Chim, Wai K.; Loh, S. K.; Er, E.; Tan, Cher Ming; Peng, Yeng-Kaung; Mahalingam, Mali; Prasad, Krishnamachar


Book ID
121225259
Publisher
SPIE
Year
2000
Weight
651 KB
Volume
4229
Category
Article

No coin nor oath required. For personal study only.


๐Ÿ“œ SIMILAR VOLUMES