SPIE Proceedings [SPIE International Symposium on Microelectronics and Assembly - Singapore, Singapore (Monday 27 November 2000)] Microelectronic Yield, Reliability, and Advanced Packaging - Estimation of the area of voids in deep-submicron aluminium interconnects using resistance-noise measurements

✍ Scribed by Chu, Lip W.; Pey, Kin L.; Chim, Wai K.; Loh, S. K.; Er, E.; Tan, Cher Ming; Peng, Yeng-Kaung; Mahalingam, Mali; Prasad, Krishnamachar

• Book ID: 121225259
• Publisher: SPIE
• Year: 2000
• Weight: 651 KB
• Volume: 4229
• Category: Article
• DOI: 10.1117/12.404874