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Chemical additives for improved copper chemical vapour deposition processing

✍ Scribed by John A.T. Norman; David A. Roberts; Arthur K. Hochberg; Paul Smith; Gary A. Petersen; John E. Parmeter; Chris A. Apblett; Thomas R. Omstead

Publisher: Elsevier Science
Year: 1995
Tongue: English
Weight: 697 KB
Volume: 262
Category: Article
ISSN: 0040-6090
DOI: 10.1016/0040-6090(94)05808-3

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