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Atomic layer chemical vapour deposition of copper

✍ Scribed by Anil U. Mane; S.A. Shivashankar

Publisher
Elsevier Science
Year
2004
Tongue
English
Weight
376 KB
Volume
7
Category
Article
ISSN
1369-8001

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## Abstract AIN was deposited pyrolytically by means of the aluminium trichloride‐ammonia process (either introducing both compounds seperately or in complex form) and by plasmachemical reaction of aluminium trichloride with nitrogen at temperatures from 600 to 1300Β°C. Layers deposited onto (100) s