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Characterization of elastic moduli of Cu thin films using nanoindentation technique

✍ Scribed by S.H. Hong; K.S. Kim; Y.-M. Kim; J.-H. Hahn; C.-S. Lee; J.-H. Park


Book ID
108103967
Publisher
Elsevier Science
Year
2005
Tongue
English
Weight
366 KB
Volume
65
Category
Article
ISSN
0266-3538

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