๐”– Bobbio Scriptorium
โœฆ   LIBER   โœฆ

Characterization of bias sputtered metallization for IC technology

โœ Scribed by N McIntyre; SJ Wright


Publisher
Elsevier Science
Year
1984
Tongue
English
Weight
598 KB
Volume
34
Category
Article
ISSN
0042-207X

No coin nor oath required. For personal study only.


๐Ÿ“œ SIMILAR VOLUMES


Copper metallization for advanced IC: re
โœ Y Morand ๐Ÿ“‚ Article ๐Ÿ“… 2000 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 836 KB

Due to the scaling down, the contribution of interconnects should become preponderant for the performance of IC. The use of low-k dielectrics and / or low resistivity metals in order to decrease the parasitic capacitance of interconnect is a technological requirement. Especially the use of copper, w

Characterization of metallic textiles de
โœ Joanne Yip; Shouqiang Jiang; Chris Wong ๐Ÿ“‚ Article ๐Ÿ“… 2009 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 936 KB

In this study, the surface appearance, light reflectivity and low-stress mechanical properties of magnetron sputter coated fabric were compared with traditional metallic treated fabrics. It is found that a layer of fine silver particles distributed evenly on the fabric surface with uniform grains an