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Characteristics of Plasma-Treated Amorphous Ta-Si-C Film as a Diffusion Barrier for Copper Metallization

✍ Scribed by Fang, Jau-Shiung; Su, Wu-Jia; Huang, Meng-Shuo; Chiu, Chin-Fu; Chin, Tsung-Shune

No coin nor oath required. For personal study only.

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