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Study of Ta–Si–N thin films for use as barrier layer in copper metallizations

✍ Scribed by D. Fischer; T. Scherg; J.G. Bauer; H.-J. Schulze; C. Wenzel

Publisher
Elsevier Science
Year
2000
Tongue
English
Weight
353 KB
Volume
50
Category
Article
ISSN
0167-9317

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