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Characterisation of Thermal Expansion Coefficient of Anisotropic Materials by Electronic Speckle Pattern Interferometry

✍ Scribed by C. Dudescu; J. Naumann; M. Stockmann; S. Nebel

Book ID
111200738
Publisher
John Wiley and Sons
Year
2006
Tongue
English
Weight
531 KB
Volume
42
Category
Article
ISSN
0039-2103

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The surface profile of an Al thin film and its thickness have been observed by electronic speckle pattern interferometry (ESPI). The Michelson interferometer was used as our basic interferometric system to obtain interference fringes on a CCD camera. These interference fringes, arising from the path