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Cathodic process in copper-tin deposition from sulphate solutions

✍ Scribed by O. Galdikiené; Z. Mockus


Book ID
104678807
Publisher
Springer
Year
1994
Tongue
English
Weight
322 KB
Volume
24
Category
Article
ISSN
0021-891X

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Kinetics of copper dissolution and depos
✍ T. Hurlen; G. Ottesen; A. Staurset 📂 Article 📅 1978 🏛 Elsevier Science 🌐 English ⚖ 572 KB

Galvanostatic single-pulse, rotating-disc and chronopotentiometric measurements on etched polycrystalline copper electrodes in semimolar mixed solutions of CuS04, MgSOL and HISO at 25°C have yielded kinetic parameters and specific rate data for either of the two consecutive chargetransfer steps of t