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Cathodic Deposition of Copper from Dilute Solutions

✍ Scribed by V.S. Kolosnitsyn; O.A. Yapryntseva


Book ID
111607063
Publisher
SP MAIK Nauka/Interperiodica
Year
2004
Tongue
English
Weight
55 KB
Volume
77
Category
Article
ISSN
1070-4272

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Electrochemical kinetic parameters for t
✍ J. T. Hinatsu; F. R. Foulkes πŸ“‚ Article πŸ“… 1991 πŸ› John Wiley and Sons 🌐 English βš– 968 KB

## Abstract The use of linear‐sweep voltammetry and chronopotentiometry for the determination of kinetic parameters for the electrolytic recovery of copper from a simulated acid‐copper electroplating waste solution was demonstrated. For the electrodeposition of copper from solutions of 0.007˜0.008