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Capacitance characterization of multipath interconnects for nanotechnology circuits

✍ Scribed by A. K. Goel; N. R. Eady

Book ID
102516419
Publisher
John Wiley and Sons
Year
2006
Tongue
English
Weight
149 KB
Volume
48
Category
Article
ISSN
0895-2477

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✦ Synopsis

Abstract

A multipath interconnect carries a signal on an electrical circuit by using the concept of parallel processing, that is, by providing two or more paths between the driver and the load. These paths are stacked vertically and isolated from one another by insulating layers between them. In this paper, we have used the Green's function method to determine the parasitic capacitances associated with a system of nanoscale multipath interconnects fabricated on a silicon‐based substrate. © 2006 Wiley Periodicals, Inc. Microwave Opt Technol Lett 48: 848–852, 2006; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.21495

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