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High-frequency characterization of coplanar waveguide and equivalent-circuit modeling of interconnection for mini-DIL package

✍ Scribed by Jae-Ho Han; Jichai Jeong


Publisher
John Wiley and Sons
Year
2004
Tongue
English
Weight
414 KB
Volume
43
Category
Article
ISSN
0895-2477

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✦ Synopsis


Abstract

Coplanar‐waveguide transmission line is designed and characteristic impedance, return loss, and bandwidth are obtained for a mini‐DIL package. For microwave‐circuit simulation of the package, equivalent electric‐circuit modeling of die‐attached components with wire‐bonded interconnections is done and key parasitic elements influencing the scattering performance are extracted. © 2004 Wiley Periodicals, Inc. Microwave Opt Technol Lett 43: 365–367, 2004; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.20470