On the capacitance and conductance calculations of integrated-circuit interconnects with thick conductors
✍ Scribed by Hasan Ymeri; Bart Nauwelaers; Karen Maex
- Publisher
- John Wiley and Sons
- Year
- 2001
- Tongue
- English
- Weight
- 139 KB
- Volume
- 30
- Category
- Article
- ISSN
- 0895-2477
- DOI
- 10.1002/mop.1307
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✦ Synopsis
Abstract
In this paper, a method for computing the capacitance and conductance matrices of multiconductor IC interconnects in a multilayered dielectric region is presented. The number of conductors and the number of dielectric layers are arbitrary. The conductors are very thick (as usual for on‐chip interconnects), and can be placed anywhere in the structure. The formulation is obtained by using a semianalytic Green's function of multilayer structures, which is integrated to a series expansion, valid for charge‐density distribution on the conductors. In addition, the quasianalytical evaluation of the entries of the Galerkin matrix leads to a very efficient and accurate computer code. The accuracy of the suggested method is validated by comparing it with the rigorous simulation data obtained from full‐wave solvers and the CAD‐oriented equivalent‐circuit approach. In our research, we have validated the capacitance and conductance matrices of interconnects on lossy silicon substrate over a wide range of frequencies up to 20 GHz. © 2001 John Wiley & Sons, Inc. Microwave Opt Technol Lett 30: 335–339, 2001.