Auger depth profiling technique and X-ray diffraction analysis have been employed to study the interdiffusion in vacuum-deposited copper-nickel bilayer thin films. An adaptation of the Whipple model was used to determine the diffusion coefficients of both nickel in copper and copper in nickel. The c
β¦ LIBER β¦
Bilayer investigation of thin film structures by modulation cathodoluminescence
β Scribed by VA Kireyev; II Razgonov
- Publisher
- Elsevier Science
- Year
- 1991
- Tongue
- English
- Weight
- 116 KB
- Volume
- 42
- Category
- Article
- ISSN
- 0042-207X
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