✦ LIBER ✦

Asymmetrical solder microstructure in Ni/Sn/Cu solder joint

✍ Scribed by S.J. Wang; C.Y. Liu

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Microstructure formation in Sn-Cu-Ni sol

✍ M. Felberbaum; T. Ventura; M. Rappaz; A. K. Dahle 📂 Article 📅 2011 🏛 The Minerals, Metals & Materials Society 🌐 English ⚖ 868 KB

Microstructural development of Sn-Ag-Cu

✍ Andreas R. Fix; Gabriel A. López; Ingo Brauer; Wolfgang Nüchter; Eric J. Mitteme 📂 Article 📅 2005 🏛 Springer US 🌐 English ⚖ 719 KB

Microstructure of interfacial reaction l

✍ Han-Byul Kang; Jee-Hwan Bae; Jeong-Won Yoon; Seung-Boo Jung; Jongwoo Park; Cheol 📂 Article 📅 2011 🏛 Springer US 🌐 English ⚖ 388 KB

Electromigration Study on Sn(Cu) Solder/

✍ S.H. Wu, Y.J. Hu, C.T. Lu, T.S. Huang, Y.H. Chang, C.Y. Liu 📂 Article 📅 2012 🏛 Springer US 🌐 English ⚖ 459 KB

Microstructure and Creep Deformation of

✍ Min He; Sylvester N. Ekpenuma; Viola L. Acoff 📂 Article 📅 2007 🏛 Springer US 🌐 English ⚖ 901 KB

Review on microstructure evolution in Sn

✍ Mrunali Sona, K. N. Prabhu 📂 Article 📅 2013 🏛 Springer US 🌐 English ⚖ 879 KB