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Asymmetrical growth of Cu6Sn5 intermetallic compounds due to rapid thermomigration of Cu in molten SnAg solder joints

โœ Scribed by Ming-Yung Guo; C.K. Lin; Chih Chen; K.N. Tu


Book ID
118460643
Publisher
Elsevier Science
Year
2012
Tongue
English
Weight
573 KB
Volume
29
Category
Article
ISSN
0966-9795

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