Asymmetrical growth of Cu6Sn5 intermetallic compounds due to rapid thermomigration of Cu in molten SnAg solder joints

✍ Scribed by Ming-Yung Guo; C.K. Lin; Chih Chen; K.N. Tu

• Book ID: 118460643
• Publisher: Elsevier Science
• Year: 2012
• Tongue: English
• Weight: 573 KB
• Volume: 29
• Category: Article
• ISSN: 0966-9795
• DOI: 10.1016/j.intermet.2012.06.003