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Finite Element Modeling of Stress Evolution in Sn Films due to Growth of the Cu6Sn5Intermetallic Compound

✍ Scribed by Eric Buchovecky; Nitin Jadhav; Allan F. Bower; Eric Chason

Book ID: 107455611
Publisher: Springer US
Year: 2009
Tongue: English
Weight: 549 KB
Volume: 38
Category: Article
ISSN: 0361-5235
DOI: 10.1007/s11664-009-0911-3

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