<p>This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside gro
Arbitrary Modeling of TSVs for 3D Integrated Circuits
โ Scribed by Khaled Salah, Yehea Ismail, Alaa El-Rouby (auth.)
- Publisher
- Springer
- Year
- 2015
- Tongue
- English
- Leaves
- 179
- Edition
- 1
- Category
- Library
No coin nor oath required. For personal study only.
โฆ Subjects
Processor Architectures
๐ SIMILAR VOLUMES
This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits.ย It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside groun
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