Physical design for 3D integrated circuits

✍ Scribed by Iniewski, Krzysztof; Tan, Chuan Seng; Todri-Sanial, Aida

Publisher: CRC Press
Year: 2016
Tongue: English
Leaves: 407
Series: Devices circuits and systems
Category: Library

No coin nor oath required. For personal study only.

✦ Table of Contents

Content: 3D INTEGRATION OVERVIEW2.5D/3D ICs: Drivers, Technology, Applications, and OutlookChuan Seng TanOverview of Physical Design Issues for 3D-Integrated CircuitsAida Todri-SanialDetailed Electrical and Reliability Study of Tapered TSVsTiantao Lu and Ankur Srivastava3D Interconnect ExtractionSung Kyu LimPHYSICAL DESIGN METHODS FOR 3D INTEGRATION3D Placement and RoutingPingqiang Zhou and Sachin S. SapatnekarPower and Signal Integrity Challenges in 3D Systems-on-ChipEmre SalmanDesign Methodology for TSV-Based 3D Clock NetworksTaewhan Kim and Heechun ParkDesign Methodology for 3D Power Delivery NetworksAida Todri-SanialRELIABILITY CONCERNS FOR 3D INTEGRATIONLive Free or Die Hard: Design for Reliability in 3D Integrated CircuitsYu-Guang Chen, Yiyu Shi, and Shih-Chieh ChangThermal Modeling and Management for 3D Stacked SystemsTiansheng Zhang, Fulya Kaplan, and Ayse K. CoskunExploration of the Thermal Design Space in 3D Integrated CircuitsSumeet S. Kumar, Amir Zjajo, and Rene van LeukenExploration of the Thermal Design Space in 3D Integrated CircuitsNizar Dahir, Ra'ed Al-Dujaily, Terrence Mak, and Alex YakolevTSV-to-Device Noise Analysis and Mitigation TechniquesBrad Gaynor, Nauman Khan, and Soha HassounCAD DESIGN TOOLS AND FUTURE DIRECTIONS FOR 3D PHYSICAL DESIGNOverview of 3D CAD Design ToolsAndy Heinig and Robert FischbachDesign Challenges and Solutions for Monolithic 3D ICsSung Kyu Lim and Yiyu ShiDesign of High-Speed Interconnects for 3D/2.5D ICs without TSVsTony Tae-Hyoung Kim and Aung Myat Thu LinnChallenges and Future Directions of 3D Physical DesignJohann Knechtel, Jens Lienig, and Cliff C.N. Sze

✦ Subjects

TECHNOLOGY & ENGINEERING / Mechanical Three-dimensional integrated circuits -- Design and construction.

📜 SIMILAR VOLUMES

Physical Design for 3D Integrated Circui

📁 Physical Design for 3D Integrated Circuits

✍ Aida Todri-Sanial, Chuan Seng Tan 📂 Library 📅 2015 🏛 CRC Press 🌐 English

Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical de

Designing TSVs for 3D Integrated Circuit

📁 Designing TSVs for 3D Integrated Circuits

✍ Nauman Khan, Soha Hassoun (auth.) 📂 Library 📅 2013 🏛 Springer-Verlag New York 🌐 English

This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside gro

Designing TSVs for 3D Integrated Circuit

📁 Designing TSVs for 3D Integrated Circuits

✍ Nauman Khan, Soha Hassoun 📂 Library 📅 2012 🏛 Springer 🌐 English

This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside groun

Nanodevices for Integrated Circuit Desig

📁 Nanodevices for Integrated Circuit Design : Nanodevices for Integrated Circuit Design

✍ Suman Lata Tripathi, Abhishek Kumar, K. Srinivasa Rao, Prasantha R. Mudimela 📂 Library 📅 2023 🏛 Wiley 🌐 English

NANODEVICES FOR INTEGRATED CIRCUIT DESIGN Nanodevices are an integral part of many of the technologies that we use every day. It is a constantly changing and evolving area, with new materials, processes, and applications coming online almost daily. Increasing demand for smart and intelligent d

Electrical Modeling and Design for 3D Sy

📁 Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC

✍ Er?Ping Li(auth.), Lajos Hanzo(eds.) 📂 Library 📅 2012 🏛 Wiley-IEEE Press 🌐 English

New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systemsBased on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power

Design of 3D Integrated Circuits and Sys

📁 Design of 3D Integrated Circuits and Systems

✍ Rohit Sharma 📂 Library 📅 2014 🏛 CRC Press 🌐 English

Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases