A main issue of the radio frequency power amplifier semiconductor components for base stations is the large amount of thermal energy created by the semiconductor. Packaging technology including heat dissipation is a critical element in nearly all new chip generations, caused by a power multiplicatio
β¦ LIBER β¦
Applications of nanotechnology within high-performance sealing materials
β Scribed by Mick Holland
- Publisher
- Elsevier Science
- Year
- 2005
- Tongue
- English
- Weight
- 611 KB
- Volume
- 2005
- Category
- Article
- ISSN
- 1350-4789
No coin nor oath required. For personal study only.
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## Abstract The development of abradeable gas turbine seals for higher temperature duties has been the target of an EUβfunded R&D project, ADSEALS, with the aim of moving towards seals that can withstand surface temperatures as high as βΌ 1100Β°C for periods of at least 24,000 h. The ADSEALS project