Application of flip-chip bonding method to optical heads
β Scribed by Tsuyoshi Nagano; Ryuichi Katayama; Yuzo Ono
- Publisher
- Elsevier Science
- Year
- 1994
- Tongue
- English
- Weight
- 142 KB
- Volume
- 26
- Category
- Article
- ISSN
- 0030-3992
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π SIMILAR VOLUMES
The residual stress induced in the bonding glass bonded to a ferrite substrate was measured with a photoelastic method. The permeability and the head output showed a maximum at a specific compressive stress. This behaviour was explained by the change of induced anisotropy caused by the magnetoelasti
## Abstract We demonstrate a 94βGHz coplanar waveguide (CPW) to rectangular waveguide transition on high permittivity sapphire substrate. Monolithically fabricated uniplanar transition is composed of the finβline taper and the openβtype CPW to slotline transition that can be fully integrated with t