Application of electronic speckle-pattern interferometry to measure in-plane thermal displacement in flip-chip packages

✍ Scribed by Baik-Woo Lee; Woosoon Jang; Dong-Won Kim; Jeung-hyun Jeong; Jae-Woong Nah; Kyung-Wook Paik; Dongil Kwon

• Publisher: Elsevier Science
• Year: 2004
• Tongue: English
• Weight: 355 KB
• Volume: 380
• Category: Article
• ISSN: 0921-5093
• DOI: 10.1016/j.msea.2004.03.068