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Application of Aerosol Jet technology in through-via interconnection for MEMS wafer-level packaging

✍ Scribed by Zhan, Zhan; Yu, Lingke; Wei, Jin; Zheng, Cheng; Sun, Daoheng; Wang, Lingyun

Book ID: 121550561
Publisher: Springer-Verlag
Year: 2014
Tongue: English
Weight: 509 KB
Volume: 21
Category: Article
ISSN: 0946-7076
DOI: 10.1007/s00542-014-2107-x

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