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Analysis and validation of thermal and packaging effects of a piezoresistive pressure sensor

✍ Scribed by Peng, Chih‐Tang; Lin, Ji‐Cheng; Lin, Chun‐Te; Chiang, Kuo‐Ning

Book ID
118253113
Publisher
Chinese Electronic Periodical Services
Year
2004
Tongue
English
Weight
302 KB
Volume
27
Category
Article
ISSN
0253-3839

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