An rf sustained argon and copper plasma for ionized physical vapor deposition of copper

✍ Scribed by Wang, W.; Foster, J.; Snodgrass, T.; Wendt, A. E.; Booske, J. H.

• Book ID: 120063911
• Publisher: American Institute of Physics
• Year: 1999
• Tongue: English
• Weight: 367 KB
• Volume: 85
• Category: Article
• ISSN: 0021-8979
• DOI: 10.1063/1.370554