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An investigation of tensile strength of dental solder joints

✍ Scribed by Eric J. Rasmussen; Richard J. Goodkind; William W. Gerberich


Book ID
118921791
Publisher
Elsevier Science
Year
1979
Tongue
English
Weight
539 KB
Volume
41
Category
Article
ISSN
1097-6841

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This study forms composite solders by adding 0.5-3 wt% of Ni particles in situ to Sn-3.5 wt%Ag lead-free solder. Cu/solder/Cu specimens are prepared by dipping two Cu rods into a solder bath to produce a solder joint. Some of the joint specimens are retained in the as-soldered condition, while the o