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An Investigation of the Tensile Strength of a Composite-To-Metal Adhesive Joint

โœ Scribed by Nicholas G. Tsouvalis; Vassilios A. Karatzas


Book ID
106335529
Publisher
Springer Netherlands
Year
2010
Tongue
English
Weight
746 KB
Volume
18
Category
Article
ISSN
0929-189X

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This study forms composite solders by adding 0.5-3 wt% of Ni particles in situ to Sn-3.5 wt%Ag lead-free solder. Cu/solder/Cu specimens are prepared by dipping two Cu rods into a solder bath to produce a solder joint. Some of the joint specimens are retained in the as-soldered condition, while the o