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Alternating reaction phases in Sn–Cu/Ni–Co solid-state reactions

✍ Scribed by Chih-chi Chen; Yue-ting Chen


Book ID
118461511
Publisher
Elsevier Science
Year
2012
Tongue
English
Weight
726 KB
Volume
545
Category
Article
ISSN
0925-8388

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It had been reported that, during the reflow of the Sn-Ag-Cu solders over the Ni-bearing surface finishes, a slight variation in Cu concentration produced different reaction products at the interface. In this study, we extended our earlier efforts to investigate whether this strong Cu concentration