Solid-state reactions between Ni and Snโ
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W.C. Luo; C.E. Ho; J.Y. Tsai; Y.L. Lin; C.R. Kao
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Article
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2005
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Elsevier Science
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English
โ 720 KB
It had been reported that, during the reflow of the Sn-Ag-Cu solders over the Ni-bearing surface finishes, a slight variation in Cu concentration produced different reaction products at the interface. In this study, we extended our earlier efforts to investigate whether this strong Cu concentration