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Solid-State Reactions between Cu(Ni) Alloys and Sn

โœ Scribed by Vesa Vuorinen; Tomi Laurila; Toni Mattila; Erkki Heikinheimo; Jorma K. Kivilahti


Publisher
Springer US
Year
2007
Tongue
English
Weight
539 KB
Volume
36
Category
Article
ISSN
0361-5235

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Solid-state reactions between Ni and Snโ€“
โœ W.C. Luo; C.E. Ho; J.Y. Tsai; Y.L. Lin; C.R. Kao ๐Ÿ“‚ Article ๐Ÿ“… 2005 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 720 KB

It had been reported that, during the reflow of the Sn-Ag-Cu solders over the Ni-bearing surface finishes, a slight variation in Cu concentration produced different reaction products at the interface. In this study, we extended our earlier efforts to investigate whether this strong Cu concentration