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Solid state interfacial reactions in electrodeposited Cu/Sn couples

✍ Scribed by Wen-ming TANG; An-qiang HE; Qi LIU; D.G. IVEY


Book ID
117693908
Publisher
Elsevier Science
Year
2010
Tongue
English
Weight
814 KB
Volume
20
Category
Article
ISSN
1003-6326

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Room temperature interfacial reactions i
✍ Wenming Tang; Anqiang He; Qi Liu; Douglas G. Ivey πŸ“‚ Article πŸ“… 2008 πŸ› Elsevier Science 🌐 English βš– 959 KB

Two Au/Sn couples electrodeposited on metallized Si wafers, a Au/Sn couple (Au deposited first) and a Sn/Au couple (Sn deposited first), were employed to study the room temperature interfacial reactions between Au and Sn. The electroplating sequence has a significant effect on the phases and the mic