โ Scribed by Shankara K. Prasad
No coin nor oath required. For personal study only.
"Advanced Wirebond Interconnection Technology addresses wire bonding from both manufacturing and reliability perspectives. It analyzes and explores the various factors that one needs to consider: design, materials, processing, equipment, quality testing and reliability engineering, and last but not least, operator training. This book is intended to be a comprehensive source of information and knowledge that enables both a newcomer to the field and a veteran who needs instant information to make a decision on a process problem. The book explains not only how to do things such as designating a bond pad or a lead finger, how to select a right bond wire, how to design a capillary and how to optimize a bonding process on the factory floor, but the book also explains why to do it that way. A CD-ROM is included, which contains 2D and 3D animations of many concepts that are discussed in this book. The animations with voice-overs help the reader grasp the ideas faster with visual experience, which leads to better retention.
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