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Advanced Thermal Management Materials || Overview of Traditional Thermal Management Materials

โœ Scribed by Jiang, Guosheng; Diao, Liyong; Kuang, Ken


Book ID
120477033
Publisher
Springer New York
Year
2012
Weight
314 KB
Category
Article
ISBN
1461419638

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โœ A. Luedtke ๐Ÿ“‚ Article ๐Ÿ“… 2004 ๐Ÿ› John Wiley and Sons ๐ŸŒ English โš– 90 KB ๐Ÿ‘ 2 views

A main issue of the radio frequency power amplifier semiconductor components for base stations is the large amount of thermal energy created by the semiconductor. Packaging technology including heat dissipation is a critical element in nearly all new chip generations, caused by a power multiplicatio