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Thermal management of electronic components with thermal adaptation composite material

✍ Scribed by Huibin Yin; Xuenong Gao; Jing Ding; Zhengguo Zhang; Yutang Fang

Book ID
103813693
Publisher
Elsevier Science
Year
2010
Tongue
English
Weight
896 KB
Volume
87
Category
Article
ISSN
0306-2619

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The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, mo