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Advanced integral isoconversional analysis for evaluating and predicting the kinetic parameters of the curing reaction of epoxy prepreg

✍ Scribed by Vafayan, Mehdy; Hosain Beheshty, Mohammad; Ghoreishy, Mir Hamid Reza; Abedini, Hossein


Book ID
122968715
Publisher
Elsevier Science
Year
2013
Tongue
English
Weight
691 KB
Volume
557
Category
Article
ISSN
0040-6031

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✍ L. F. Yang; K. D. Yao; W. Koh πŸ“‚ Article πŸ“… 1999 πŸ› John Wiley and Sons 🌐 English βš– 219 KB πŸ‘ 2 views

In this article, the curing kinetics of two fast cure flip-chip epoxy encapsulants under both isothermal and nonisothermal conditions are investigated by differential scanning calorimetry. The method allows determination of the most suitable kinetic model and corresponding parameters. The kinetic an