Kinetics analysis of the curing reaction
β
L. F. Yang; K. D. Yao; W. Koh
π
Article
π
1999
π
John Wiley and Sons
π
English
β 219 KB
π 2 views
In this article, the curing kinetics of two fast cure flip-chip epoxy encapsulants under both isothermal and nonisothermal conditions are investigated by differential scanning calorimetry. The method allows determination of the most suitable kinetic model and corresponding parameters. The kinetic an