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Adaptive bonding technique for precise assembly of three-dimensional microstructures

✍ Scribed by Park, Sang-Hu; Jeong, Jun-Ho; Choi, Dae-Geun; Kim, Ki-Don; Altun, Ali Ozhan; Lee, Eung-Sug; Yang, Dong-Yol; Lee, Kwang-Sup


Book ID
120352763
Publisher
American Institute of Physics
Year
2007
Tongue
English
Weight
670 KB
Volume
90
Category
Article
ISSN
0003-6951

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