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Studies on three-dimensional moulding, bonding and assembling of low-temperature-cofired ceramics for MEMS and MST applications

✍ Scribed by P.K. Khanna; B. Hornbostel; M. Burgard; W. Schäfer; J. Dorner


Book ID
113781013
Publisher
Elsevier Science
Year
2005
Tongue
English
Weight
465 KB
Volume
89
Category
Article
ISSN
0254-0584

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