✦ LIBER ✦

Acceptance-test device for reliability monitoring of electronic units and components

✍ Scribed by N. I. Vlasov

Publisher: Springer US
Year: 1977
Tongue: English
Weight: 211 KB
Volume: 20
Category: Article
ISSN: 0543-1972
DOI: 10.1007/bf00817137

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

4889242 Device for testing and sorting e

4889242 Device for testing and sorting electronic components, more particularly integrated circuit chips

✍ HansH Willberg; Ekkehar Ueberreiter 📂 Article 📅 1991 🏛 Elsevier Science 🌐 English ⚖ 178 KB

Reliability physics of electronic device

Reliability physics of electronic devices through material characterization and environmental stress testing techniques

✍ S.U.M. Rao 📂 Article 📅 1994 🏛 Elsevier Science 🌐 English ⚖ 551 KB

Use of process control data in acceptanc

Use of process control data in acceptance procedures for high reliability components : B. H. Nichols, Electron. Compon., June (1969), p. 705

📂 Article 📅 1970 🏛 Elsevier Science 🌐 English ⚖ 98 KB

Comparative study of thermal cycling and

Comparative study of thermal cycling and thermal shocks tests on electronic components reliability

📂 Article 📅 2004 🏛 Elsevier Science 🌐 English ⚖ 978 KB

In this work, the first reliability results of Thermal Cycling Tests (TCT, air-air test) and Thermal Shock Tests (TST, liquidliquid test) on medium power electronic components are discussed. The influence of dwell times, extremes temperatures and mean temperature is investigated. This study is based

Monitored burn-in as the method of quali

Monitored burn-in as the method of quality control in electronic components and devices production

✍ Lubomír Slunský 📂 Article 📅 1989 🏛 Elsevier Science 🌐 English ⚖ 203 KB

Criterion for normalizing reliability an

Criterion for normalizing reliability and repairability indexes of electronic medical devices

✍ A. I. Vladov; Yu. F. Kabatov 📂 Article 📅 1968 🏛 Springer US 🌐 English ⚖ 402 KB